Call for papers


January 19, 2018: Full paper submission

February 2, 2018: Full paper submission

February 16, Full paper submission

March 2, 2018: notification of acceptance to Authors

March 17, 2018: Final Paper Submission Date

March 17, 2018: preliminary program posted online

April 2, 2018: deadline for early-bird registration

April 22, 2018: deadline for early-bird registration


A PDF version of this SPI2018 call for papers can be downloaded here.

The Technical Program Committee (TPC) is seeking original and unpublished contributions on all aspects of Signal and Power Integrity. Detailed instructions for manuscript submission are available here. All contributions will be subjected to a rigorous review process, conducted by the TPC. Accepted papers will be included in the conference program as oral or poster presentations, depending on the results of the review process. All accepted papers will be published on IEEE Xplore.


  • Modeling and simulation for SI/PI
  • Coupled Signal and Power Integrity analysis
  • Noise reduction and equalization techniques
  • High-speed link design and modeling
  • Power distribution networks
  • RF/microwave/mixed signal systems
  • 3D IC and packages (TSV/SiP/SoC)
  • Nano-interconnects and nano-structures
  • Electromagnetic theory and modeling
  • Transmission line theory and modeling
  • Macromodeling and reduced order models
  • Electromagnetic compatibility
  • Design methodology/flow
  • Measurements
  • Jitter and noise modeling
  • Stochastic/sensitivity analysis
  • Electro-thermal modeling
  • Chip-package co-design
  • Novel CAD concepts
  • Optical interconnects


In order to recognize excellence in research, a Best Student Paper Award will be assigned by the TPC based on the following criteria:

  • Novelty
  • Advancement of the theory and application
  • Quality of the presented results
  • Quality of the written manuscript
  • Practicality and industrial relevance of the presented work
  • Quality of the oral/poster presentation

Each accepted paper authored by a student is eligible for the SPI Best Student Paper Award, provided that the student is the first and primary author, and the presenter at the conference.


Along with the traditional technical sessions, and following the success of the previous editions, SPI2018 will host an Industry Forum. This special session will be reserved to both invited and contributed talks from the industry. The objective is to present and discuss problems rather than solutions, for those aspects of Signal and Power Integrity (and related topics) that have no good solution yet, neither theoretical, nor in form of EDA tools. The explicit goal is to foster the discussion between industry, academia, and tool vendors, so that the three communities can cooperate in the future and focus on the most relevant problems.

The contributions to the Industry Forum will be handled by an Industry Advisory Board (IAB), in cooperation with the General Chair and the Program Co-Chairs. Only a one-page abstract is required, with a clear statement and definition of the talk contents. Abstract revision will be carried out by the IAB. Talks at the SPI2018 Industry Forum will be informal (with slides). The individual presentations will then be followed by a panel-like discussion and a plenary Q/A session. No corresponding paper will be published on IEEEXplore, but the abstract and the slides will be made available to the conference delegates and to the general public through this web site.

Contributions for the Industry Forum as well as any inquiry about this initiative should be sent by Email to

Email: spi2018-industryforum@sciencesconf.org

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